Printed Circuit Boards

Single sided -12 Layer
Prototypes available in 1 week max
Short run -2 weeks
Produciton-3 weeks
24 HR. & 48 HR. turn available, at competitive cost!

**Production “Blanket Orders” encouraged for cost savings **

• IS0 compliant firm
• RoHS lead-free solder, immersion silver, immersion gold, Entek
• Cam system- Orbotech, Image 5000 Gerber Laser Photo-plotting
• Automated Optical Inspection (AOI), multilayer inspection for quality assurance
• Real-time(bar code) order status
• Gold finger line
• U.L. APPROVED ->170 C., 5 MIL
• Scoring for array panelization
• Net list electrical test
• Optical multilayer registration
• "Flying probe" electrical test
• FTP file transfer available
• Liquid photo-imageable solder mask (L.P.I.)

printed circuit board assembly & complete product assembly

Deeply devoted to taking PCBA (Printed Circuit Board Assembly) and complete product assembly to a new level. With a diverse background and an expertise in the subject, we are committed to creating a winning solution for you and your team. We look forward to integrating our manufacturing abilities into your facility which, in turn, will allow you to focus on your core competencies.

Design Services

• designed for manufacturability (DFM)
• DFx consulting and analysis
• Mechanical and electrical design
• PCBA layout from NPI and prototype through end of life
• RoHs Conversions
• Engineering obsolescence on the component level
• Systems Testing and Testing Developments
• Design verification
• Test development

business development / NPI

• rapid prototyping equaling success
• Design review
• Cost reduction strategy
• Rapid turnkey and consignment prototyping
• Dfx feedback and implementation

high mix / low volume

• build for speed, ready for change
• Core competency
• Turned for high velocity and rapid changeover
  • Point of use controls
  • Visual management
• Capable of extremely small lot sizes (Prototype: 1to 5)

low mix / high volume

• multiple lines allow for rapid, large-scale production SMT
• Limited to SMT capability only
• Flexible work tolerance scheduling
• Overseas integration

system integration

• ready, set, ship
• Completed solutions delivered the right way
  • PCBA assembly
  • Mechanical assembly
  • Wire harness and cable assembly
  • Test capable
• System assembled, tested and verified
• Drop ship available

Qualifications

• Mil-Standard 2000, 2000 A
• IPC-610D Certified
• IPC/EIA J-STD-001D Certified
• ISO 9001 : 2008
• RoHs (Restriction of Hazardous Standards) Compliant
• FDA Registered
• Small Business Certified
• Woman Owned Certified
• ITAR certified

flexible circuits rigid flex   flex circuit assemblies

Deeply devoted to taking PCBA (Printed Circuit Board Assembly) and complete product assembly to a new level. With a diverse background and an expertise in the subject, we are committed to creating a winning solution for you and your team. Specializing in complex solutions for the industrial control, instrumentation, medical, telecomunications, military and aerospace markets. We look forward to integrating our manufacturing abilities into your facility which, in turn, will allow you to focus on your core competencies.

engineering design

• Over 150 years experience in flex circuit design, manufacturing, assembly and quality
• Extensive engineering experience allows us to work hand-in-hand with our customers to engineer a cost-effective design correctly the first time
• Design for manufacturability, functionality, and repeatability
• Expert at complex solutions, special materials, and cutting edge processes
• Controlled impedance design, fabrication and testing
• Extensive design support; CAD/CAM, testing and assembly, design from schematics

complex solutions

• Fine lines and spaces below 2mil lines and space in production
• Fi0ne Line- 50 microns or less
• Micro vias-50 microns
• Multilayer Flex, Rigid Flex to 18 layers
• Tight tolerance ZIF connection configurations
• Impedance control flex
• High speed circuits
• Sculptured Circuits
• Flex heaters

assembly

• Quick turn prototypes, first articles and production quantities
• Low, Medium and High Volume Quantities
• Full Turn Key / Box Build/ Sub-assembly Capabilities
• Folding, forming and heatsinks
• Immersion tin, wire bondable gold, hard gold, immersion gold and HASL finishes
• Photo imageable covercoats (PIC) and flexible solder masks
• Selective thru hole pad plating / button plate
• Dynamic flex circuits with rolled and annealed copper
• LF, FR, adhesiveless clads, all polyimide constructions
• Blind and Buried vias
• Dual side access
• Copper and silver shields
• Beryllium copper and nickel alloys
• Planar transformer windings
• RoHS and Leaded Soldering
• Climate Controlled Environment
• ESD Control Measures and Monitoring

automated (SMT assembly)

• Modern Panasonic and Electrovert Equipment
• Single Sided & Double Sided SMT assembly
• 01005, 0201, CCGA, COB, MCM, MEM, BGA & micro-BGA, Chip Scale Package (CSP), Fine and ultra fine pitch high pin count connectors (12mil pitch), Flip chips, SOIC, TSSOPBGA, leadless packages, Odd Form Capable
• Paste in hole for through hole components
• Connectors up to 4” in length
• Ultra Fine Pitch Components

hand assembly

• Wide variety of connector types
• Hot Bar Soldering
• Small Run / Prototype SMT Assembly
• Forming

test capabilities

• Dielectric Withstanding Voltage
• Flex & Flex Assembly Electrical Continuity Testing
• Isolation
• Insulation Resistance
• Hi Pot
• High Voltage
• Automated Optical Inspection (AOI)
• Scanning Electron Microscope (SEM)
• Microsection Inspection
• X-ray capabilities

specifications

• IPC - Class 1,2, & 3
• IPC-6013
• The Qualification and Performance Specification for Flexible Printed Boards that supersedes IPC-RF-245 and IPC-FC250A
• IPC-2223
• MIL Compliant Class 3
• ISO 9001:2008 & ISO 13485:2003 certified
• ITAR
• UL

pre-production analysis

• Design Review
• Net List Approval
• CAD Design - Layout / Panelization
• Fabrication - Drawings / Documentation
• Deliverables